MB86930-40ZF-G vs IDT79RV4650-150DPI8 feature comparison

MB86930-40ZF-G FUJITSU Limited

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IDT79RV4650-150DPI8 Integrated Device Technology Inc

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FUJITSU LTD INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP QFP
Package Description HEAT SINK, CERAMIC, QFP-208 FQFP,
Pin Count 208 208
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature EMULATOR SUPPORT HARDWARE; 5 PIPELINE STAGES; 40 MIPS PEAK AND 37 MIPS SUSTAINED PERFORMANCE
Address Bus Width 32 64
Bit Size 32 64
Boundary Scan YES NO
Clock Frequency-Max 40 MHz 150 MHz
External Data Bus Width 32 64
Format FIXED POINT FLOATING POINT
Integrated Cache NO YES
JESD-30 Code S-CQFP-G208 S-PQFP-G208
JESD-609 Code e0 e0
Length 27.2 mm 28 mm
Low Power Mode NO YES
Number of DMA Channels
Number of External Interrupts 4
Number of Serial I/Os
Number of Terminals 208 208
On Chip Data RAM Width
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code HFQFP FQFP
Package Equivalence Code HQFP208,1.2SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK, HEAT SINK/SLUG, FINE PITCH FLATPACK, FINE PITCH
Qualification Status Not Qualified Not Qualified
RAM (words) 0
Seated Height-Max 9.8 mm 4.1 mm
Speed 40 MHz 150 MHz
Supply Current-Max 570 mA
Supply Voltage-Max 5.25 V 3.465 V
Supply Voltage-Min 4.75 V 3.135 V
Supply Voltage-Nom 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Width 27.2 mm 28 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 1

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