MB84VD21184DA-85PBS vs IS71V16F64GS08-8585AI feature comparison

MB84VD21184DA-85PBS FUJITSU Limited

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IS71V16F64GS08-8585AI Integrated Silicon Solution Inc

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Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer FUJITSU LTD INTEGRATED SILICON SOLUTION INC
Part Package Code BGA BGA
Package Description LFBGA, BGA69,10X10,32 11 X 12 MM, BGA-101
Pin Count 69 101
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 85 ns 85 ns
Additional Feature SRAM IS CONFIGURED AS 256K X 16/512K X 8 SRAM ORGANISATION IS 512K X 16/1M X 8
JESD-30 Code R-PBGA-B69 R-PBGA-B101
JESD-609 Code e0 e0
Length 11 mm 12 mm
Memory Density 16777216 bit 67108864 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Mixed Memory Type FLASH+SRAM FLASH+SRAM
Number of Functions 1 1
Number of Terminals 69 101
Number of Words 1048576 words 4194304 words
Number of Words Code 1000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -40 °C
Organization 1MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA69,10X10,32 BGA101,12X14,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Supply Current-Max 0.05 mA 0.053 mA
Supply Voltage-Max (Vsup) 3.3 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 11 mm
Base Number Matches 1 1
Pbfree Code No
Standby Current-Max 0.000005 A

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Compare IS71V16F64GS08-8585AI with alternatives