MB84VD21184DA-85PBS vs AM41DL3244GB85IS feature comparison

MB84VD21184DA-85PBS FUJITSU Limited

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AM41DL3244GB85IS Spansion

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Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer FUJITSU LTD SPANSION INC
Part Package Code BGA BGA
Package Description LFBGA, BGA69,10X10,32 8 X 11.60 MM, FBGA-73
Pin Count 69 73
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 85 ns 85 ns
Additional Feature SRAM IS CONFIGURED AS 256K X 16/512K X 8 STATIC RAM IS ORGANISED AS 512K X 8 OR 256K X 16; FLASH CAN ALSO BE ORGANISED AS 4M X 8
JESD-30 Code R-PBGA-B69 R-PBGA-B73
JESD-609 Code e0 e0
Length 11 mm 11.6 mm
Memory Density 16777216 bit 33554432 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Mixed Memory Type FLASH+SRAM FLASH+SRAM
Number of Functions 1 1
Number of Terminals 69 73
Number of Words 1048576 words 2097152 words
Number of Words Code 1000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -40 °C
Organization 1MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA69,10X10,32 BGA73,10X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Supply Current-Max 0.05 mA 0.045 mA
Supply Voltage-Max (Vsup) 3.3 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 8 mm
Base Number Matches 2 2
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260

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