MB84VD21184DA-85PBS
vs
AM41DL3244GB85IS
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
FUJITSU LTD
SPANSION INC
Part Package Code
BGA
BGA
Package Description
LFBGA, BGA69,10X10,32
8 X 11.60 MM, FBGA-73
Pin Count
69
73
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
85 ns
85 ns
Additional Feature
SRAM IS CONFIGURED AS 256K X 16/512K X 8
STATIC RAM IS ORGANISED AS 512K X 8 OR 256K X 16; FLASH CAN ALSO BE ORGANISED AS 4M X 8
JESD-30 Code
R-PBGA-B69
R-PBGA-B73
JESD-609 Code
e0
e0
Length
11 mm
11.6 mm
Memory Density
16777216 bit
33554432 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
16
Mixed Memory Type
FLASH+SRAM
FLASH+SRAM
Number of Functions
1
1
Number of Terminals
69
73
Number of Words
1048576 words
2097152 words
Number of Words Code
1000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-25 °C
-40 °C
Organization
1MX16
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA69,10X10,32
BGA73,10X12,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.4 mm
Supply Current-Max
0.05 mA
0.045 mA
Supply Voltage-Max (Vsup)
3.3 V
3.3 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
8 mm
8 mm
Base Number Matches
2
2
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Compare MB84VD21184DA-85PBS with alternatives
Compare AM41DL3244GB85IS with alternatives