MB84VD21184DA-85PBS
vs
AM42DL3234GB71IT
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
FUJITSU SEMICONDUCTOR AMERICA INC
SPANSION INC
Part Package Code
BGA
BGA
Package Description
LFBGA,
8 X 11.60 MM, FBGA-73
Pin Count
69
73
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Additional Feature
STATIC RAM IS ORGANIZED AS 256K X 16 OR 512K X 8; FLASH MEMORY IS ALSO ORGANIZED AS 2M X 8
PSEUDO SRAM IS ORGANISED AS 256K X 16; FLASH CAN ALSO BE ORGANISED AS 4M X 8
JESD-30 Code
R-PBGA-B69
R-PBGA-B73
Length
11 mm
11.6 mm
Memory Density
16777216 bit
33554432 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
69
73
Number of Words
1048576 words
2097152 words
Number of Words Code
1000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-25 °C
-40 °C
Organization
1MX16
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.4 mm
Supply Voltage-Max (Vsup)
3.3 V
3.3 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
8 mm
8 mm
Base Number Matches
2
3
Rohs Code
Access Time-Max
70 ns
JESD-609 Code
e0
Mixed Memory Type
FLASH+SRAM
Moisture Sensitivity Level
3
Package Equivalence Code
BGA73,10X12,32
Peak Reflow Temperature (Cel)
260
Supply Current-Max
0.045 mA
Terminal Finish
TIN LEAD
Compare MB84VD21184DA-85PBS with alternatives
Compare AM42DL3234GB71IT with alternatives