MB84VD21182EM-70PBS vs MB84VD21193EM-70PBS feature comparison

MB84VD21182EM-70PBS Spansion

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MB84VD21193EM-70PBS FUJITSU Semiconductor Limited

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Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer SPANSION INC FUJITSU LTD
Part Package Code BGA BGA
Package Description TFBGA, BGA56,8X8,32 TFBGA, BGA56,8X8,32
Pin Count 56 56
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 70 ns 70 ns
Additional Feature SRAM IS ORGANIZED AS 512K X 8 OR 256K X 16; FLASH MEMORY CAN ALSO CONFIGURABLE AS 2M X 8 SRAM IS ORGANIZED AS 256K X 16/512K X 8
JESD-30 Code R-PBGA-B56 R-PBGA-B56
JESD-609 Code e0 e0
Length 7.2 mm 7.2 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Mixed Memory Type FLASH+SRAM FLASH+SRAM
Number of Functions 1 1
Number of Terminals 56 56
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1MX16 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA56,8X8,32 BGA56,8X8,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Standby Current-Max 0.000005 A 0.000015 A
Supply Current-Max 0.05 mA 0.05 mA
Supply Voltage-Max (Vsup) 3.3 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 7 mm 7 mm
Base Number Matches 4 4
Pbfree Code No

Compare MB84VD21182EM-70PBS with alternatives

Compare MB84VD21193EM-70PBS with alternatives