MB8281-15P
vs
P51C65-12
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FUJITSU SEMICONDUCTOR AMERICA INC
INTEL CORP
Package Description
DIP,
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Mode
STATIC COLUMN
STATIC COLUMN
Access Time-Max
150 ns
120 ns
Additional Feature
RAS ONLY REFRESH
RAS ONLY REFRESH
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
Length
19.35 mm
19.304 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
STATIC COLUMN DRAM
STATIC COLUMN DRAM
Memory Width
1
1
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
16
16
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Organization
64KX1
64KX1
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
128
256
Seated Height-Max
4.65 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
NMOS
CMOS
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
2
1
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
16
I/O Type
SEPARATE
JESD-609 Code
e0
Operating Temperature-Max
70 °C
Operating Temperature-Min
Package Equivalence Code
DIP16,.3
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Compare MB8281-15P with alternatives
Compare P51C65-12 with alternatives