MB8281-15P vs P51C64L-12 feature comparison

MB8281-15P FUJITSU Semiconductor Limited

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P51C64L-12 Intel Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC INTEL CORP
Package Description DIP, DIP, DIP16,.3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.02 8542.32.00.02
Access Mode STATIC COLUMN NIBBLE
Access Time-Max 150 ns 120 ns
Additional Feature RAS ONLY REFRESH RAS ONLY REFRESH
JESD-30 Code R-PDIP-T16 R-PDIP-T16
Length 19.35 mm 19.304 mm
Memory Density 65536 bit 65536 bit
Memory IC Type STATIC COLUMN DRAM NIBBLE MODE DRAM
Memory Width 1 1
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 16 16
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Organization 64KX1 64KX1
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Refresh Cycles 128 256
Seated Height-Max 4.65 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology NMOS CMOS
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 2 1
Pbfree Code No
Rohs Code No
Part Package Code DIP
Pin Count 16
I/O Type SEPARATE
JESD-609 Code e0
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Equivalence Code DIP16,.3
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD

Compare MB8281-15P with alternatives

Compare P51C64L-12 with alternatives