MB81464-12PV vs SMJ4464-12JDS feature comparison

MB81464-12PV FUJITSU Limited

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SMJ4464-12JDS Texas Instruments

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer FUJITSU LTD TEXAS INSTRUMENTS INC
Part Package Code LCC DIP
Package Description , 0.300 INCH, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-18
Pin Count 18 18
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.02 8542.32.00.02
Access Mode PAGE PAGE
Access Time-Max 120 ns 120 ns
Additional Feature RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O Type COMMON COMMON
JESD-30 Code R-PQCC-J18 R-CDIP-T18
Length 12.45 mm 22.606 mm
Memory Density 262144 bit 262144 bit
Memory IC Type PAGE MODE DRAM PAGE MODE DRAM
Memory Width 4 4
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 18 18
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 110 °C
Operating Temperature-Min -55 °C
Organization 64KX4 64KX4
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code QCCJ DIP
Package Equivalence Code LDCC18,.33X.53 DIP18,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER IN-LINE
Refresh Cycles 256 256
Seated Height-Max 3.55 mm 5.08 mm
Standby Current-Max 0.005 A
Supply Current-Max 0.065 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology NMOS NMOS
Terminal Form J BEND THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position QUAD DUAL
Width 7.24 mm 7.62 mm
Base Number Matches 2 2
Pbfree Code No
Rohs Code No
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Screening Level 38535Q/M;38534H;883B
Temperature Grade OTHER
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare SMJ4464-12JDS with alternatives