MB81464-12PV
vs
MB81464-12PSZ
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
FUJITSU LTD
|
FUJITSU SEMICONDUCTOR AMERICA INC
|
Part Package Code |
LCC
|
|
Package Description |
,
|
ZIP,
|
Pin Count |
18
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.02
|
8542.32.00.02
|
Access Mode |
PAGE
|
PAGE
|
Access Time-Max |
120 ns
|
120 ns
|
Additional Feature |
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH
|
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH
|
I/O Type |
COMMON
|
|
JESD-30 Code |
R-PQCC-J18
|
R-PZIP-T20
|
Length |
12.45 mm
|
25.88 mm
|
Memory Density |
262144 bit
|
262144 bit
|
Memory IC Type |
PAGE MODE DRAM
|
PAGE MODE DRAM
|
Memory Width |
4
|
4
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
18
|
20
|
Number of Words |
65536 words
|
65536 words
|
Number of Words Code |
64000
|
64000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
64KX4
|
64KX4
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
ZIP
|
Package Equivalence Code |
LDCC18,.33X.53
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
IN-LINE
|
Refresh Cycles |
256
|
256
|
Seated Height-Max |
3.55 mm
|
8.26 mm
|
Standby Current-Max |
0.005 A
|
|
Supply Current-Max |
0.065 mA
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
NMOS
|
NMOS
|
Terminal Form |
J BEND
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
ZIG-ZAG
|
Width |
7.24 mm
|
2.85 mm
|
Base Number Matches |
2
|
2
|
Qualification Status |
|
Not Qualified
|
Temperature Grade |
|
COMMERCIAL
|
|
|
|
Compare MB81464-12PV with alternatives
Compare MB81464-12PSZ with alternatives