MAX9830AETA+
vs
NCP2820FCT1
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
ON SEMICONDUCTOR
|
| Part Package Code |
SON
|
BGA
|
| Package Description |
2 X 2 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-229, TDFN-8
|
VFBGA, BGA9,3X3,20
|
| Pin Count |
8
|
9
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Bandwidth-Nom |
22 kHz
|
20 kHz
|
| Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
CLASS D AUDIO AMPLIFIER
|
| JESD-30 Code |
S-PDSO-N8
|
S-PBGA-B9
|
| JESD-609 Code |
e3
|
e1
|
| Length |
2 mm
|
1.45 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
9
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Power-Nom |
2.25 W
|
2.63 W
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
VFBGA
|
| Package Equivalence Code |
SOLCC8,.08,20
|
BGA9,3X3,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.8 mm
|
0.66 mm
|
| Supply Current-Max |
2.5 mA
|
4.6 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.6 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN SILVER COPPER
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
2 mm
|
1.45 mm
|
| Base Number Matches |
3
|
2
|
| Samacsys Manufacturer |
|
onsemi
|
|
|
|
Compare MAX9830AETA+ with alternatives
Compare NCP2820FCT1 with alternatives