MAX6956ATL+TGH7
vs
ST8004CDR
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
STMICROELECTRONICS
|
Package Description |
HVQCCN,
|
SOP,
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Interface IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
JESD-30 Code |
S-XQCC-N40
|
R-PDSO-G28
|
JESD-609 Code |
e3
|
e4
|
Length |
6 mm
|
17.9 mm
|
Moisture Sensitivity Level |
1
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
40
|
28
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-25 °C
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
SOP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
250
|
Seated Height-Max |
0.8 mm
|
2.65 mm
|
Supply Voltage-Max |
5.5 V
|
6.5 V
|
Supply Voltage-Min |
2.5 V
|
2.7 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Temperature Grade |
AUTOMOTIVE
|
OTHER
|
Terminal Finish |
MATTE TIN
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
6 mm
|
7.5 mm
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
SOIC
|
Pin Count |
|
28
|
Additional Feature |
|
ALSO OPERATES AT 5V SUPPLY
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare MAX6956ATL+TGH7 with alternatives
Compare ST8004CDR with alternatives