MAX5842LEUB-T
vs
MCP4922T-E/ST
feature comparison
Pbfree Code |
No
|
Yes
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
SOIC
|
TSSOP
|
Package Description |
MINIATURE, MICRO MAX PACKAGE-10
|
4.40 MM, PLASTIC, TSSOP-14
|
Pin Count |
10
|
14
|
Reach Compliance Code |
not_compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog Output Voltage-Max |
5 V
|
5.5 V
|
Analog Output Voltage-Min |
|
|
Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
Input Bit Code |
BINARY
|
BINARY
|
Input Format |
SERIAL
|
SERIAL
|
JESD-30 Code |
S-PDSO-G10
|
R-PDSO-G14
|
JESD-609 Code |
e0
|
e3
|
Length |
3 mm
|
5 mm
|
Linearity Error-Max (EL) |
0.3906%
|
0.2929%
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
12
|
12
|
Number of Functions |
1
|
1
|
Number of Terminals |
10
|
14
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
245
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
1.2 mm
|
Settling Time-Nom (tstl) |
4 µs
|
4.5 µs
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Finish |
TIN LEAD
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
3 mm
|
4.4 mm
|
Base Number Matches |
2
|
2
|
ECCN Code |
|
EAR99
|
Factory Lead Time |
|
4 Weeks
|
Samacsys Manufacturer |
|
Microchip
|
Package Equivalence Code |
|
TSSOP14,.25
|
Supply Current-Max |
|
0.7 mA
|
|
|
|
Compare MAX5842LEUB-T with alternatives
Compare MCP4922T-E/ST with alternatives