M4A3-256/128-65FAC
vs
CY37256VP256-66BBC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
VANTIS CORP
CYPRESS SEMICONDUCTOR CORP
Reach Compliance Code
unknown
not_compliant
Clock Frequency-Max
118 MHz
50 MHz
JESD-30 Code
R-PBGA-B200
S-PBGA-B256
Number of Dedicated Inputs
1
Number of I/O Lines
128
197
Number of Terminals
200
256
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
0 DEDICATED INPUTS, 128 I/O
1 DEDICATED INPUTS, 197 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Shape
RECTANGULAR
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Programmable Logic Type
EE PLD
EE PLD
Propagation Delay
6.5 ns
20 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
2
1
Rohs Code
Part Package Code
BGA
Package Description
17 X 17 MM, 1 MM PITCH, FBGA-256
Pin Count
256
HTS Code
8542.39.00.01
Additional Feature
256 MACROCELLS
In-System Programmable
YES
JESD-609 Code
e0
JTAG BST
YES
Length
17 mm
Moisture Sensitivity Level
3
Number of Macro Cells
256
Package Equivalence Code
BGA256,16X16,40
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
1.6 mm
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
1 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
17 mm
Compare M4A3-256/128-65FAC with alternatives
Compare CY37256VP256-66BBC with alternatives