CY37256VP256-66BBC
vs
M5LV-256/160-15YI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
ADVANCED MICRO DEVICES INC
Part Package Code
BGA
QFP
Package Description
17 X 17 MM, 1 MM PITCH, FBGA-256
FQFP,
Pin Count
256
208
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
256 MACROCELLS
Clock Frequency-Max
50 MHz
55 MHz
In-System Programmable
YES
JESD-30 Code
S-PBGA-B256
S-PQFP-G208
JESD-609 Code
e0
JTAG BST
YES
Length
17 mm
28 mm
Moisture Sensitivity Level
3
Number of Dedicated Inputs
1
Number of I/O Lines
197
160
Number of Macro Cells
256
Number of Terminals
256
208
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
1 DEDICATED INPUTS, 197 I/O
0 DEDICATED INPUTS, 160 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
FQFP
Package Equivalence Code
BGA256,16X16,40
QFP208,1.2SQ,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
FLATPACK, FINE PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programmable Logic Type
EE PLD
EE PLD
Propagation Delay
20 ns
20 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
3.95 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
17 mm
28 mm
Base Number Matches
1
3
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