M4A3-256/128-12FANI
vs
M5A3-256/160-12YC
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
VANTIS CORP
Part Package Code
BGA
Package Description
LEAD FREE, FPBGA-256
Pin Count
256
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
Additional Feature
YES
256 MACROCELLS
Architecture
PAL-TYPE
Clock Frequency-Max
52.6 MHz
47.6 MHz
In-System Programmable
YES
YES
JESD-30 Code
S-PBGA-B256
S-PQFP-G208
JESD-609 Code
e1
e0
JTAG BST
YES
YES
Length
17 mm
Moisture Sensitivity Level
3
Number of Dedicated Inputs
14
Number of I/O Lines
128
160
Number of Macro Cells
256
256
Number of Terminals
256
208
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
14 DEDICATED INPUTS, 128 I/O
0 DEDICATED INPUTS, 160 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
QFP
Package Equivalence Code
BGA256,16X16,40
QFP208,1.2SQ,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
FLATPACK
Peak Reflow Temperature (Cel)
250
Programmable Logic Type
EE PLD
EE PLD
Propagation Delay
12 ns
12 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.1 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
Tin/Lead (Sn/Pb)
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
40
Width
17 mm
Base Number Matches
1
2
Compare M4A3-256/128-12FANI with alternatives
Compare M5A3-256/160-12YC with alternatives