M5A3-256/160-12YC
vs
XCR3256XL-12FTG256I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
XILINX INC
Part Package Code
QFP
BGA
Package Description
PLASTIC, QFP-208
FBGA-256
Pin Count
208
256
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
YES
YES
Clock Frequency-Max
71.4 MHz
88 MHz
In-System Programmable
YES
YES
JESD-30 Code
S-PQFP-G208
S-PBGA-B256
JESD-609 Code
e0
e1
JTAG BST
YES
YES
Length
28 mm
17 mm
Moisture Sensitivity Level
3
3
Number of Dedicated Inputs
Number of I/O Lines
160
164
Number of Inputs
160
Number of Macro Cells
256
256
Number of Outputs
160
Number of Terminals
208
256
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
0 DEDICATED INPUTS, 160 I/O
0 DEDICATED INPUTS, 164 I/O
Output Function
MACROCELL
MACROCELL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FQFP
LBGA
Package Equivalence Code
QFP208,1.2SQ,20
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, FINE PITCH
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
225
260
Programmable Logic Type
EE PLD
EE PLD
Propagation Delay
12 ns
12 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.1 mm
1.55 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
2.7 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
1 mm
Terminal Position
QUAD
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
28 mm
17 mm
Base Number Matches
2
2
Pbfree Code
ECCN Code
EAR99
Factory Lead Time
12 Weeks
Compare M5A3-256/160-12YC with alternatives
Compare XCR3256XL-12FTG256I with alternatives