M5A3-256/160-12YC vs XCR3256XL-12FTG256I feature comparison

M5A3-256/160-12YC Lattice Semiconductor Corporation

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XCR3256XL-12FTG256I AMD Xilinx

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer LATTICE SEMICONDUCTOR CORP XILINX INC
Part Package Code QFP BGA
Package Description PLASTIC, QFP-208 FBGA-256
Pin Count 208 256
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature YES YES
Clock Frequency-Max 71.4 MHz 88 MHz
In-System Programmable YES YES
JESD-30 Code S-PQFP-G208 S-PBGA-B256
JESD-609 Code e0 e1
JTAG BST YES YES
Length 28 mm 17 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs
Number of I/O Lines 160 164
Number of Inputs 160
Number of Macro Cells 256 256
Number of Outputs 160
Number of Terminals 208 256
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 0 DEDICATED INPUTS, 160 I/O 0 DEDICATED INPUTS, 164 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP LBGA
Package Equivalence Code QFP208,1.2SQ,20 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225 260
Programmable Logic Type EE PLD EE PLD
Propagation Delay 12 ns 12 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.1 mm 1.55 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 2.7 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 1 mm
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 28 mm 17 mm
Base Number Matches 2 2
Pbfree Code Yes
ECCN Code EAR99
Factory Lead Time 12 Weeks

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