M463S1724DN1-C7A vs HB52RD168DB-B6FL feature comparison

M463S1724DN1-C7A Samsung Semiconductor

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HB52RD168DB-B6FL Hitachi Ltd

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC HITACHI LTD
Part Package Code MODULE MODULE
Package Description DIMM, DIMM144,20 DIMM, DIMM144,32
Pin Count 144 144
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.32 8542.32.00.02
Access Mode DUAL BANK PAGE BURST SINGLE BANK PAGE BURST
Access Time-Max 5.4 ns 6 ns
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH; WD-MAX; SEATED HGT-NOM
Clock Frequency-Max (fCLK) 133 MHz 100 MHz
I/O Type COMMON COMMON
JESD-30 Code R-XDMA-N144 R-XDMA-N144
Memory Density 1073741824 bit 67108864 bit
Memory IC Type SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE
Memory Width 64 4
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 144 144
Number of Words 16777216 words 16777216 words
Number of Words Code 16000000 16000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 65 °C
Operating Temperature-Min
Organization 16MX64 16MX4
Output Characteristics 3-STATE 3-STATE
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIMM DIMM
Package Equivalence Code DIMM144,20 DIMM144,32
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Qualification Status Not Qualified Not Qualified
Refresh Cycles 4096 4096
Self Refresh YES YES
Standby Current-Max 0.016 A 0.016 A
Supply Current-Max 0.92 mA 1.76 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.8 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Length 67.6 mm
Seated Height-Max 25.4 mm
Width 3.8 mm

Compare M463S1724DN1-C7A with alternatives

Compare HB52RD168DB-B6FL with alternatives