M38510/33001BCX vs I74F00N feature comparison

M38510/33001BCX QP Semiconductor

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I74F00N Philips Semiconductors

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer QP SEMICONDUCTOR INC PHILIPS SEMICONDUCTORS
Part Package Code DIP
Package Description DIP, DIP, DIP14,.3
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family F/FAST
JESD-30 Code R-GDIP-T14 R-PDIP-T14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4
Number of Inputs 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 7 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 7 4
Rohs Code Yes
JESD-609 Code e4
Max I(ol) 0.02 A
Package Equivalence Code DIP14,.3
Power Supply Current-Max (ICC) 10.2 mA
Prop. Delay@Nom-Sup 6 ns
Schmitt Trigger NO
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch 2.54 mm

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