M38510/33001BCX vs 5962F9651502QXA feature comparison

M38510/33001BCX QP Semiconductor

Buy Now

5962F9651502QXA Cobham Semiconductor Solutions

Buy Now Datasheet
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer QP SEMICONDUCTOR INC AEROFLEX COLORADO SPRINGS
Part Package Code DIP DFP
Package Description DIP, DFP,
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family F/FAST ACT
JESD-30 Code R-GDIP-T14 R-CDFP-F14
Logic IC Type NAND GATE NOR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DFP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE FLATPACK
Propagation Delay (tpd) 7 ns 17 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO YES
Technology TTL CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE FLAT
Terminal Position DUAL DUAL
Base Number Matches 7 2
JESD-609 Code e0
Length 8.626 mm
Screening Level MIL-PRF-38535 Class Q
Seated Height-Max 2.575 mm
Terminal Finish TIN LEAD
Terminal Pitch 1.27 mm
Total Dose 300k Rad(Si) V
Width 6.475 mm

Compare M38510/33001BCX with alternatives

Compare 5962F9651502QXA with alternatives