M38510/33001BCX
vs
5962F9651503QXX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
AEROFLEX COLORADO SPRINGS
Part Package Code
DIP
DFP
Package Description
DIP,
DFP,
Pin Count
14
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
kg CO2e/kg
12.4
12.4
Average Weight (mg)
1630.6
602.4
CO2e (mg)
20219.441
7469.76
Category CO2 Kg
12.4
12.4
Compliance Temperature Grade
Military: -55C to +125C
Military: -55C to +125C
Family
F/FAST
ACT
JESD-30 Code
R-GDIP-T14
R-CDFP-F14
Logic IC Type
NAND GATE
NOR GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
FLATPACK
Propagation Delay (tpd)
7 ns
17 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class B
MIL-PRF-38535 Class Q
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
3 V
Supply Voltage-Nom (Vsup)
5 V
4.5 V
Surface Mount
NO
YES
Technology
TTL
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
FLAT
Terminal Position
DUAL
DUAL
Base Number Matches
7
2
Qualifications
Rad Hard
Length
8.626 mm
Seated Height-Max
2.575 mm
Terminal Pitch
1.27 mm
Total Dose
300k Rad(Si) V
Width
6.475 mm
Compare M38510/33001BCX with alternatives
Compare 5962F9651503QXX with alternatives