M38510/30009BDX
vs
JM38510/30009SDA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DFP
Package Description
DFP,
CERAMIC, DFP-14
Pin Count
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
LS
LS
JESD-30 Code
R-GDFP-F14
R-GDFP-F14
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
1
1
Number of Inputs
8
8
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DFP
DFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Propagation Delay (tpd)
38 ns
20 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
TTL
TTL
Temperature Grade
MILITARY
MILITARY
Terminal Form
FLAT
FLAT
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Length
9.21 mm
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Screening Level
MIL-M-38510 Class S
Seated Height-Max
2.03 mm
Terminal Pitch
1.27 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
6.285 mm
Compare M38510/30009BDX with alternatives
Compare JM38510/30009SDA with alternatives