M38510/23104BEX vs S82S10F feature comparison

M38510/23104BEX SRI International Sarnoff

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S82S10F NXP Semiconductors

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer SRI INTERNATIONAL SIGNETICS CORP
Part Package Code DIP
Package Description DIP, ,
Pin Count 16
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 70 ns
JESD-30 Code R-XDIP-T16 R-GDIP-T16
Memory Density 1024 bit 1024 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 1 1
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 1024 words 1024 words
Number of Words Code 1000 1000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 1KX1 1KX1
Package Body Material UNSPECIFIED CERAMIC, GLASS-SEALED
Package Code DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Number of Ports 1
Output Enable NO

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