Findchips: Compare M38510/23104BEX vs 93L425DMQB

M38510/23104BEX vs 93L425DMQB feature comparison

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Part Life Cycle Code	Active	Obsolete
Ihs Manufacturer	SRI INTERNATIONAL	NATIONAL SEMICONDUCTOR CORP
Part Package Code	DIP
Package Description	DIP,	DIP, DIP16,.3
Pin Count	16
Reach Compliance Code	unknown	unknown
ECCN Code	3A001.A.2.C	3A001.A.2.C
HTS Code	8542.32.00.41	8542.32.00.41
Access Time-Max	70 ns	70 ns
JESD-30 Code	R-XDIP-T16	R-XDIP-T16
Memory Density	1024 bit	1024 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM
Memory Width	1	1
Number of Functions	1
Number of Terminals	16	16
Number of Words	1024 words	1024 words
Number of Words Code	1000	1000
Operating Mode	ASYNCHRONOUS	ASYNCHRONOUS
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-55 °C
Organization	1KX1	1KX1
Package Body Material	UNSPECIFIED	CERAMIC
Package Code	DIP	DIP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL
Qualification Status	Not Qualified	Not Qualified
Supply Voltage-Max (Vsup)	5.5 V
Supply Voltage-Min (Vsup)	4.5 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	NO	NO
Technology	TTL	TTL
Temperature Grade	MILITARY	MILITARY
Terminal Form	THROUGH-HOLE	THROUGH-HOLE
Terminal Position	DUAL	DUAL
Base Number Matches	2	3
Rohs Code		No
JESD-609 Code		e0
Output Characteristics		3-STATE
Package Equivalence Code		DIP16,.3
Screening Level		38535Q/M;38534H;883B
Supply Current-Max		0.075 mA
Terminal Finish		Tin/Lead (Sn/Pb)
Terminal Pitch		2.54 mm
	Memory » SRAMs	Memory » SRAMs