M38510/20404BEX vs DM74S571BJ feature comparison

M38510/20404BEX NXP Semiconductors

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DM74S571BJ Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP DIP
Package Description DIP, DIP, DIP16,.3
Pin Count 16 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 35 ns 35 ns
JESD-30 Code R-XDIP-T16 R-GDIP-T16
Memory Density 16384 bit 2048 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 4 4
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 512 words 512 words
Number of Words Code 4000 512
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 4KX4 512X4
Package Body Material UNSPECIFIED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.165 mA 0.13 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 4 1
Rohs Code No
JESD-609 Code e0
Length 19.43 mm
Output Characteristics 3-STATE
Package Equivalence Code DIP16,.3
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare M38510/20404BEX with alternatives

Compare DM74S571BJ with alternatives