M38510/20304BEX
vs
M38510/20301BEX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
QP SEMICONDUCTOR INC
LANSDALE SEMICONDUCTOR INC
Part Package Code
DIP
DIP
Package Description
DIP,
DIP,
Pin Count
16
16
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
kg CO2e/kg
12
12
Average Weight (mg)
1187.4
1187.4
CO2e (mg)
14248.8
14248.8
Category CO2 Kg
12
12
Compliance Temperature Grade
Military: -55C to +125C
Military: -55C to +125C
Access Time-Max
35 ns
80 ns
JESD-30 Code
R-XDIP-T16
R-XDIP-T16
Memory Density
1024 bit
16777216 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
4
16
Number of Functions
1
1
Number of Terminals
16
16
Number of Words
256 words
256 words
Number of Words Code
256
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
256X4
1MX16
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
4
4
Candidate List Date
2015-12-17
Conflict Mineral Status
DRC Conflict Free
Conflict Mineral Status Source
Conflict Minerals Declaration
Compare M38510/20304BEX with alternatives
Compare M38510/20301BEX with alternatives