M38510/20301BEX vs M38510/20302SEA feature comparison

M38510/20301BEX Lansdale Semiconductor Inc

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M38510/20302SEA NXP Semiconductors

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer LANSDALE SEMICONDUCTOR INC NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 16 16
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 80 ns 250 ns
JESD-30 Code R-XDIP-T16 R-XDIP-T16
Memory Density 16777216 bit 65536 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 16 8
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 256 words 256 words
Number of Words Code 1000000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 1MX16 8KX8
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 4 1
JESD-609 Code e3/e4
Screening Level MIL-M-38510 Class B
Supply Current-Max 0.13 mA
Terminal Finish TIN/NICKEL PALLADIUM GOLD

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Compare M38510/20302SEA with alternatives