M38510/20301BEX
vs
M38510/20302SEA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
LANSDALE SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Part Package Code
DIP
DIP
Package Description
DIP,
DIP,
Pin Count
16
16
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
80 ns
250 ns
JESD-30 Code
R-XDIP-T16
R-XDIP-T16
Memory Density
16777216 bit
65536 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
16
8
Number of Functions
1
1
Number of Terminals
16
16
Number of Words
256 words
256 words
Number of Words Code
1000000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
1MX16
8KX8
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
4
1
JESD-609 Code
e3/e4
Screening Level
MIL-M-38510 Class B
Supply Current-Max
0.13 mA
Terminal Finish
TIN/NICKEL PALLADIUM GOLD
Compare M38510/20301BEX with alternatives
Compare M38510/20302SEA with alternatives