M38510/12903BPA vs SG55472Y feature comparison

M38510/12903BPA Texas Instruments

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SG55472Y Microsemi Corporation

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Pbfree Code Yes
Rohs Code No No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC MICROSEMI CORP
Part Package Code DIP DIP
Package Description DIP, DIP8,.3 DIP, DIP8,.3
Pin Count 8 8
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Built-in Protections OVER CURRENT
Driver Number of Bits 2 2
Input Characteristics GATED
Interface IC Type NAND GATE BASED PERIPHERAL DRIVER NAND GATE BASED PERIPHERAL DRIVER
JESD-30 Code R-GDIP-T8 R-CDIP-T8
JESD-609 Code e0 e0
Length 9.58 mm
Number of Functions 2 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Characteristics OPEN-COLLECTOR
Output Current Flow Direction SINK SINK
Output Current-Max 0.3 A 0.3 A
Output Peak Current Limit-Nom 0.5 A
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Qualified Not Qualified
Screening Level MIL-M-38510
Seated Height-Max 5.08 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Turn-off Time 0.035 µs 0.065 µs
Turn-on Time 0.035 µs 0.05 µs
Width 7.62 mm
Base Number Matches 3 2

Compare M38510/12903BPA with alternatives

Compare SG55472Y with alternatives