M38510/05554BEX vs MC14050BDR2 feature comparison

M38510/05554BEX Rochester Electronics LLC

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MC14050BDR2 Motorola Mobility LLC

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS LLC MOTOROLA INC
Part Package Code DIP SOIC
Package Description DIP, SOP, SOP16,.25
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T16 R-PDSO-G16
Logic IC Type BUFFER BUFFER
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 345 ns 80 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class B
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE GULL WING
Terminal Position DUAL DUAL
Base Number Matches 1 1
Additional Feature IOH = 1MA @ VOH = 2.5V; IOL = 2.6MA @ VOL = 0.4V; WITH EXTENDED INPUT VOLTAGE
JESD-609 Code e0
Length 9.9 mm
Package Equivalence Code SOP16,.25
Packing Method TR
Schmitt Trigger NO
Seated Height-Max 1.75 mm
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 1.27 mm
Width 3.9 mm

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Compare MC14050BDR2 with alternatives