M38510/05554BEX vs DV4050BN feature comparison

M38510/05554BEX Rochester Electronics LLC

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DV4050BN avg Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC AVG SEMICONDUCTORS
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T16 R-PDIP-T16
Logic IC Type BUFFER BUFFER
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 345 ns 140 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-PRF-38535 Class B
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 6 1
Additional Feature CMOS-TTL LEVEL TRANSLATOR
Length 19.175 mm
Load Capacitance (CL) 50 pF
Seated Height-Max 4.44 mm
Terminal Pitch 2.54 mm
Width 7.62 mm

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