M2GL025T-FCS325
vs
M2GL025T-FCSG325
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
BGA, BGA325,21X21,20
|
11 X 11 MM, 0.50 MM PITCH, ROHS COMPLIANT, FBGA-325
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Microsemi Corporation
|
|
| JESD-30 Code |
S-PBGA-B325
|
S-PBGA-B325
|
| Number of Inputs |
180
|
180
|
| Number of Logic Cells |
27696
|
27696
|
| Number of Outputs |
180
|
180
|
| Number of Terminals |
325
|
325
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA325,21X21,20
|
BGA325,21X21,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max |
1.26 V
|
1.26 V
|
| Supply Voltage-Min |
1.14 V
|
1.14 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Base Number Matches |
2
|
2
|
| Factory Lead Time |
|
10 Weeks
|
| Length |
|
11 mm
|
| Moisture Sensitivity Level |
|
3
|
| Packing Method |
|
TRAY
|
| Terminal Pitch |
|
0.5 mm
|
| Width |
|
11 mm
|
|
|
|
Compare M2GL025T-FCS325 with alternatives
Compare M2GL025T-FCSG325 with alternatives