M29W160EB70ZS6T
vs
RC28F160F3T95
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
INTEL CORP
Package Description
11 X 13 MM, 1 MM PITCH, FBGA-64
TBGA, BGA64,8X8,40
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
70 ns
95 ns
Alternate Memory Width
8
Boot Block
BOTTOM
TOP
JESD-30 Code
R-PBGA-B64
R-PBGA-B64
Length
13 mm
13 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
64
64
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1MX16
1MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
TBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
2.7 V
Seated Height-Max
1.4 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
NOR TYPE
Width
11 mm
10 mm
Base Number Matches
1
1
Part Package Code
BGA
Pin Count
64
Additional Feature
MIN 100,000 BLOCK ERASE CYCLES; TOP BOOT BLOCK
Command User Interface
YES
Data Polling
NO
JESD-609 Code
e0
Number of Sectors/Size
8,31
Package Equivalence Code
BGA64,8X8,40
Page Size
4 words
Qualification Status
Not Qualified
Sector Size
4K,32K
Standby Current-Max
0.000075 A
Supply Current-Max
0.06 mA
Terminal Finish
TIN LEAD
Toggle Bit
NO
Compare M29W160EB70ZS6T with alternatives
Compare RC28F160F3T95 with alternatives