RC28F160F3T95
vs
M29W160EB90ZS6
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEL CORP
MICRON TECHNOLOGY INC
Part Package Code
BGA
Package Description
TBGA, BGA64,8X8,40
11 X 13 MM, 1 MM PITCH, FBGA-64
Pin Count
64
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
95 ns
90 ns
Additional Feature
MIN 100,000 BLOCK ERASE CYCLES; TOP BOOT BLOCK
Boot Block
TOP
BOTTOM
Command User Interface
YES
Data Polling
NO
JESD-30 Code
R-PBGA-B64
R-PBGA-B64
JESD-609 Code
e0
Length
13 mm
13 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Sectors/Size
8,31
Number of Terminals
64
64
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1MX16
1MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
LBGA
Package Equivalence Code
BGA64,8X8,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY, LOW PROFILE
Page Size
4 words
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
2.7 V
3 V
Qualification Status
Not Qualified
Seated Height-Max
1.2 mm
1.4 mm
Sector Size
4K,32K
Standby Current-Max
0.000075 A
Supply Current-Max
0.06 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
NO
Type
NOR TYPE
NOR TYPE
Width
10 mm
11 mm
Base Number Matches
1
2
Alternate Memory Width
8
Compare RC28F160F3T95 with alternatives
Compare M29W160EB90ZS6 with alternatives