M27W800-100B6 vs KM23C8100H-10 feature comparison

M27W800-100B6 STMicroelectronics

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KM23C8100H-10 Samsung Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS SAMSUNG SEMICONDUCTOR INC
Part Package Code DIP DIP
Package Description DIP, DIP, DIP42,.6
Pin Count 42 42
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 100 ns 100 ns
Alternate Memory Width 8 16
JESD-30 Code R-PDIP-T42 R-PDIP-T42
Length 52.455 mm 52.43 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type OTP ROM MASK ROM
Memory Width 16 8
Number of Functions 1 1
Number of Terminals 42 42
Number of Words 524288 words 1048576 words
Number of Words Code 512000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 512KX16 1MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Current-Max 0.03 mA 0.06 mA
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 2.7 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code DIP42,.6
Standby Current-Max 0.00005 A
Terminal Finish TIN LEAD

Compare M27W800-100B6 with alternatives

Compare KM23C8100H-10 with alternatives