M27C322-100F3 vs HY23V32000D-70 feature comparison

M27C322-100F3 STMicroelectronics

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HY23V32000D-70 SK Hynix Inc

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS SK HYNIX INC
Part Package Code DIP DIP
Package Description 0.370 X 0.450 INCH, ROHS COMPLIANT, CERAMIC, FDIP-42 DIP, DIP42,.6
Pin Count 42 42
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.71
Access Time-Max 100 ns 70 ns
I/O Type COMMON
JESD-30 Code R-CDIP-T42 R-PDIP-T42
JESD-609 Code e3
Length 54.635 mm 52.451 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type UVPROM MASK ROM
Memory Width 16 8
Number of Functions 1 1
Number of Terminals 42 42
Number of Words 2097152 words 4194304 words
Number of Words Code 2000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -40 °C
Organization 2MX16 4MX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code WDIP DIP
Package Equivalence Code DIP42,.6 DIP42,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.71 mm 4.826 mm
Standby Current-Max 0.0001 A 0.00005 A
Supply Current-Max 0.07 mA 0.035 mA
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE COMMERCIAL
Terminal Finish MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 1

Compare M27C322-100F3 with alternatives

Compare HY23V32000D-70 with alternatives