M1A3PE3000L-FG896M
vs
A3PE3000L-FG896M
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
1 MM PITCH, FBGA-896
BGA, BGA896,30X30,40
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
20 Weeks
Clock Frequency-Max
250 MHz
250 MHz
JESD-30 Code
S-PBGA-B896
S-PBGA-B896
JESD-609 Code
e0
e0
Length
31 mm
31 mm
Moisture Sensitivity Level
3
3
Number of CLBs
75264
75264
Number of Equivalent Gates
3000000
3000000
Number of Inputs
620
620
Number of Logic Cells
75264
75264
Number of Outputs
620
620
Number of Terminals
896
896
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
75264 CLBS, 3000000 GATES
75264 CLBS, 3000000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA896,30X30,40
BGA896,30X30,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Packing Method
TRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.44 mm
2.44 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
31 mm
31 mm
Base Number Matches
3
3
Samacsys Manufacturer
Microsemi Corporation
Peak Reflow Temperature (Cel)
225
Time@Peak Reflow Temperature-Max (s)
20
Compare M1A3PE3000L-FG896M with alternatives
Compare A3PE3000L-FG896M with alternatives