A3PE3000L-FG896M vs A3PE3000L-FG896 feature comparison

A3PE3000L-FG896M Microsemi Corporation

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A3PE3000L-FG896 Actel Corporation

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Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP ACTEL CORP
Package Description BGA, BGA896,30X30,40 31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896
Reach Compliance Code unknown compliant
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01
Samacsys Manufacturer Microsemi Corporation
Clock Frequency-Max 250 MHz 250 MHz
JESD-30 Code S-PBGA-B896 S-PBGA-B896
JESD-609 Code e0 e0
Length 31 mm 31 mm
Moisture Sensitivity Level 3 3
Number of CLBs 75264 75264
Number of Equivalent Gates 3000000 3000000
Number of Inputs 620 620
Number of Logic Cells 75264 75264
Number of Outputs 620 620
Number of Terminals 896 896
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 75264 CLBS, 3000000 GATES 75264 CLBS, 3000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA896,30X30,40 BGA896,30X30,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.44 mm 2.44 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 31 mm 31 mm
Base Number Matches 3 3

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