M1A3P600L-1FG144
vs
M1A3P600L-FG144YI
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144
|
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
12 Weeks
|
|
JESD-30 Code |
S-PBGA-B144
|
S-PBGA-B144
|
Length |
13 mm
|
13 mm
|
Number of Equivalent Gates |
600000
|
|
Number of Inputs |
97
|
97
|
Number of Logic Cells |
13824
|
13824
|
Number of Outputs |
97
|
97
|
Number of Terminals |
144
|
144
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
600000 GATES
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
BGA
|
Package Equivalence Code |
BGA144,12X12,40
|
BGA144,12X12,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY
|
Programmable Logic Type |
FPGA SOC
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max |
1.55 mm
|
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
13 mm
|
13 mm
|
Base Number Matches |
3
|
3
|
Clock Frequency-Max |
|
250 MHz
|
JESD-609 Code |
|
e0
|
Moisture Sensitivity Level |
|
3
|
Number of CLBs |
|
13824
|
Qualification Status |
|
Not Qualified
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
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