M1A3P600L-FG144YI vs M1A3P600L-1FGG144I feature comparison

M1A3P600L-FG144YI Microsemi Corporation

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M1A3P600L-1FGG144I Microsemi Corporation

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description BGA, BGA144,12X12,40 LBGA, BGA144,12X12,40
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 250 MHz 350 MHz
JESD-30 Code S-PBGA-B144 S-PBGA-B144
JESD-609 Code e0 e1
Moisture Sensitivity Level 3 3
Number of Inputs 97 97
Number of Logic Cells 13824 13824
Number of Outputs 97 97
Number of Terminals 144 144
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA144,12X12,40 BGA144,12X12,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Base Number Matches 3 2
Length 13 mm
Number of CLBs 13824
Number of Equivalent Gates 600000
Organization 13824 CLBS, 600000 GATES
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.55 mm
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Time@Peak Reflow Temperature-Max (s) 30
Width 13 mm

Compare M1A3P600L-FG144YI with alternatives

Compare M1A3P600L-1FGG144I with alternatives