M1A3P600L-FG144YI
vs
M1A3P600L-1FGG144I
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Package Description
BGA, BGA144,12X12,40
LBGA, BGA144,12X12,40
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
250 MHz
350 MHz
JESD-30 Code
S-PBGA-B144
S-PBGA-B144
JESD-609 Code
e0
e1
Moisture Sensitivity Level
3
3
Number of Inputs
97
97
Number of Logic Cells
13824
13824
Number of Outputs
97
97
Number of Terminals
144
144
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA144,12X12,40
BGA144,12X12,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
3
2
Length
13 mm
Number of CLBs
13824
Number of Equivalent Gates
600000
Organization
13824 CLBS, 600000 GATES
Peak Reflow Temperature (Cel)
260
Seated Height-Max
1.55 mm
Supply Voltage-Max
1.575 V
Supply Voltage-Min
1.14 V
Supply Voltage-Nom
1.2 V
Time@Peak Reflow Temperature-Max (s)
30
Width
13 mm
Compare M1A3P600L-FG144YI with alternatives
Compare M1A3P600L-1FGG144I with alternatives