M1A3P600L-FG144YI
vs
M1A3P600L-1FGG144
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
250 MHz
JESD-30 Code
S-PBGA-B144
S-PBGA-B144
JESD-609 Code
e0
Length
13 mm
13 mm
Moisture Sensitivity Level
3
Number of CLBs
13824
Number of Inputs
97
97
Number of Logic Cells
13824
13824
Number of Outputs
97
97
Number of Terminals
144
144
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA144,12X12,40
BGA144,12X12,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FPGA SOC
Qualification Status
Not Qualified
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
13 mm
13 mm
Base Number Matches
3
3
Package Description
13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144
Factory Lead Time
12 Weeks
Number of Equivalent Gates
600000
Organization
600000 GATES
Seated Height-Max
1.55 mm
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