M1A3P600-2FGG256IY
vs
M1A3P600-2FG256YI
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI SOC PRODUCTS GROUP
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Moisture Sensitivity Level
3
3
Peak Reflow Temperature (Cel)
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Time@Peak Reflow Temperature-Max (s)
30
Base Number Matches
2
3
Part Package Code
BGA
Package Description
LBGA,
Pin Count
256
JESD-30 Code
S-PBGA-B256
JESD-609 Code
e0
Length
17 mm
Number of CLBs
13824
Number of Equivalent Gates
600000
Number of Terminals
256
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
13824 CLBS, 600000 GATES
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
Seated Height-Max
1.7 mm
Supply Voltage-Max
1.575 V
Supply Voltage-Min
1.425 V
Supply Voltage-Nom
1.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Width
17 mm
Compare M1A3P600-2FGG256IY with alternatives
Compare M1A3P600-2FG256YI with alternatives