M1A3P600-2FGG256IY
vs
M1A3P600-2FG256II
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
ACTEL CORP
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
250
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Time@Peak Reflow Temperature-Max (s)
30
Base Number Matches
2
3
Package Description
17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256
Clock Frequency-Max
350 MHz
JESD-30 Code
S-PBGA-B256
Length
17 mm
Number of CLBs
13824
Number of Equivalent Gates
600000
Number of Terminals
256
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
13824 CLBS, 600000 GATES
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Equivalence Code
BGA256,16X16,40
Package Shape
SQUARE
Package Style
GRID ARRAY
Qualification Status
Not Qualified
Seated Height-Max
1.8 mm
Supply Voltage-Max
1.575 V
Supply Voltage-Min
1.425 V
Supply Voltage-Nom
1.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Width
17 mm
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