LXP2175NE
vs
DS2175+
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
LEVEL ONE
MAXIM INTEGRATED PRODUCTS INC
Package Description
DIP, DIP16,.3
0.300 INCH, DIP-16
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8473.30.11.40
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
JESD-609 Code
e0
e3
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Telecom IC Type
ELASTIC BUFFER
ELASTIC BUFFER
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
MATTE TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
11
Pbfree Code
Part Package Code
DIP
Pin Count
16
ECCN Code
EAR99
Factory Lead Time
4 Weeks
Carrier Type
CEPT PCM-30/E-1
Data Rate
2048 Mbps
Length
19.175 mm
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Seated Height-Max
4.572 mm
Supply Current-Max
0.016 mA
Time@Peak Reflow Temperature-Max (s)
30
Width
7.62 mm
Compare LXP2175NE with alternatives
Compare DS2175+ with alternatives