LXP2175NE
vs
DS2175N
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
LEVEL ONE
DALLAS SEMICONDUCTOR
Package Description
DIP, DIP16,.3
0.300 INCH, DIP-16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
JESD-609 Code
e0
e0
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Telecom IC Type
ELASTIC BUFFER
ELASTIC BUFFER
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
3
Supply Current-Max
16 mA
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