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Parametric » Telecommunication Circuits » Digital Transmission Support

Parametric results for: Digital Transmission Support

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DS2176N
 Dallas Semiconductor 		Check for Price No Transferred 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER T-1(DS1) 1 10 mA INDUSTRIAL R-PDIP-T24 e0 Not Qualified 85 °C -40 °C 24 PLASTIC/EPOXY DIP DIP24,.3 RECTANGULAR IN-LINE NO Tin/Lead (Sn/Pb) THROUGH-HOLE 2.54 mm DUAL 7.62 mm 31.877 mm 4.699 mm DALLAS SEMICONDUCTOR 0.300 INCH, DIP-24 unknown
LXP2176PE
 Level One 		Check for Price No Transferred 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER T-1(DS1) 1 10 mA INDUSTRIAL S-PQCC-J28 e0 Not Qualified 85 °C -40 °C 28 PLASTIC/EPOXY QCCJ LDCC28,.5SQ SQUARE CHIP CARRIER YES Tin/Lead (Sn/Pb) J BEND 1.27 mm QUAD LEVEL ONE QCCJ, LDCC28,.5SQ unknown 8542.39.00.01
T5691IP
 Exar Corporation 		Check for Price No Obsolete 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER T-1(DS1) 1 10 mA INDUSTRIAL R-PDIP-T24 e0 Not Qualified 85 °C -40 °C 24 PLASTIC/EPOXY DIP DIP24,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL EXAR CORP DIP, DIP24,.3 unknown 8542.39.00.01 DIP 24
DS2175
 Maxim Integrated Products 		Check for Price No Obsolete 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER 1 16 µA COMMERCIAL R-PDIP-T16 e0 Not Qualified 1 70 °C 16 PLASTIC/EPOXY DIP DIP16,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 7.62 mm 19.175 mm 4.572 mm MAXIM INTEGRATED PRODUCTS INC 0.300 INCH, DIP-16 compliant
DS2175S+T&R
 Maxim Integrated Products 		Check for Price Yes Yes Obsolete 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER 1 16 µA COMMERCIAL R-PDSO-G16 e3 Not Qualified 1 70 °C 260 30 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 7.5 mm 10.3 mm 2.65 mm MAXIM INTEGRATED PRODUCTS INC 0.300 INCH, SOIC-16 compliant 8542.32.00.71 SOIC 16 EAR99
DS2175SN
 Dallas Semiconductor 		Check for Price No Transferred 5 V CMOS ELASTIC BUFFER 1 16 µA INDUSTRIAL R-PDSO-G16 e0 Not Qualified 85 °C -40 °C 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES Tin/Lead (Sn/Pb) GULL WING 1.27 mm DUAL 7.5 mm 10.3 mm 2.65 mm DALLAS SEMICONDUCTOR 0.300 INCH, SOIC-16 unknown
LXP2175NC
 Intel Corporation 		Check for Price No No Obsolete 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER 1 COMMERCIAL R-PDIP-T16 e0 Not Qualified 70 °C 16 PLASTIC/EPOXY DIP DIP16,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL 7.62 mm 5.84 mm INTEL CORP DIP, DIP16,.3 compliant 8542.39.00.01 DIP 16
LXP2175SE
 Intel Corporation 		Check for Price No No Obsolete 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER 1 INDUSTRIAL R-PDSO-G16 e0 Not Qualified 85 °C -40 °C 16 PLASTIC/EPOXY SOP SOP16,.4 RECTANGULAR SMALL OUTLINE YES TIN LEAD GULL WING 1.27 mm DUAL 7.5 mm 10.3 mm 2.65 mm INTEL CORP SOP, SOP16,.4 compliant 8542.39.00.01 SOIC 16
DS2176QN
 Maxim Integrated Products 		Check for Price No No Obsolete 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER T-1(DS1) 1 10 mA INDUSTRIAL S-PQCC-J28 e0 Not Qualified 1 85 °C -40 °C 28 PLASTIC/EPOXY QCCJ LDCC28,.5SQ SQUARE CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 11.505 mm 11.505 mm 4.57 mm MAXIM INTEGRATED PRODUCTS INC PLASTIC, LCC-28 compliant 8542.39.00.01 QLCC 28 EAR99
DS2176Q/T&R
 Maxim Integrated Products 		Check for Price No No Obsolete 5 V CMOS CEPT PCM-30/E-1 2.048 Gbps ELASTIC BUFFER T-1(DS1) 1 10 mA COMMERCIAL S-PQCC-J28 e0 Not Qualified 1 70 °C 28 PLASTIC/EPOXY QCCJ LDCC28,.5SQ SQUARE CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 11.505 mm 11.505 mm 4.57 mm MAXIM INTEGRATED PRODUCTS INC PLASTIC, LCC-28 compliant 8542.39.00.01 QLCC 28
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