LU82562V
vs
AT86RF230-ZUR
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
INTEL CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
BGA
Package Description
BGA,
HVQCCN,
Pin Count
81
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B81
S-XQCC-N32
JESD-609 Code
e1
Length
10 mm
5 mm
Number of Functions
1
1
Number of Terminals
81
32
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
BGA
HVQCCN
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Qualification Status
Not Qualified
Seated Height-Max
1.815 mm
1 mm
Supply Voltage-Nom
3.3 V
3 V
Surface Mount
YES
YES
Telecom IC Type
INTERFACE CIRCUIT
INTERFACE CIRCUIT
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
NO LEAD
Terminal Pitch
1 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Width
10 mm
5 mm
Base Number Matches
1
1
ECCN Code
5A992.C
Technology
CMOS
Compare LU82562V with alternatives
Compare AT86RF230-ZUR with alternatives