LU82562V vs LS100-B256 feature comparison

LU82562V Intel Corporation

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LS100-B256 I-Cube Inc

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer INTEL CORP I-CUBE INC
Part Package Code BGA
Package Description BGA, BGA, BGA256,20X20,50
Pin Count 81
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
JESD-30 Code S-PBGA-B81 S-PBGA-B256
JESD-609 Code e1 e0
Length 10 mm
Number of Functions 1 1
Number of Terminals 81 256
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.815 mm
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Telecom IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
Temperature Grade OTHER COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 10 mm
Base Number Matches 1 1
Package Equivalence Code BGA256,20X20,50
Technology CMOS

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