LTC1050CS8
vs
ICL7650SIJD
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
LINEAR TECHNOLOGY CORP
HARRIS SEMICONDUCTOR
Part Package Code
SOIC
Package Description
PLASTIC, SOIC-8
DIP, DIP14,.3
Pin Count
8
Manufacturer Package Code
S8
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
CHOPPER-STAB
CHOPPER-STAB
Average Bias Current-Max (IIB)
0.00015 µA
0.00005 µA
Bias Current-Max (IIB) @25C
0.000075 µA
0.00001 µA
Common-mode Reject Ratio-Nom
130 dB
115 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
5 µV
10 µV
JESD-30 Code
R-PDSO-G8
R-GDIP-T14
JESD-609 Code
e0
e0
Length
4.9 mm
Low-Bias
YES
YES
Low-Offset
YES
YES
Moisture Sensitivity Level
1
Neg Supply Voltage Limit-Max
-9 V
-9 V
Neg Supply Voltage-Nom (Vsup)
-5 V
-5 V
Number of Functions
1
1
Number of Terminals
8
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-25 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
SOP
DIP
Package Equivalence Code
SOP8,.25
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Peak Reflow Temperature (Cel)
235
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
Slew Rate-Nom
4 V/us
2.5 V/us
Supply Current-Max
2.3 mA
3.5 mA
Supply Voltage Limit-Max
9 V
9 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
20
Unity Gain BW-Nom
2500
2000
Voltage Gain-Min
1000000
5600000
Width
3.9 mm
Base Number Matches
2
4
Common-mode Reject Ratio-Min
120 dB
Micropower
NO
Power
NO
Programmable Power
NO
Wideband
NO
Compare LTC1050CS8 with alternatives
Compare ICL7650SIJD with alternatives