LSM303DLH
vs
LSM303DLHTR
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
Part Package Code |
LGA
|
LGA
|
Package Description |
5 X 5 MM, 1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, LGA-16
|
5 X 5 MM, 1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, LGA-16
|
Pin Count |
16
|
16
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
STMicroelectronics
|
STMicroelectronics
|
Analog IC - Other Type |
ANALOG CIRCUIT
|
ANALOG CIRCUIT
|
JESD-30 Code |
S-PBGA-B28
|
S-PBGA-B28
|
JESD-609 Code |
e4
|
e4
|
Length |
5 mm
|
5 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-30 °C
|
-30 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
LCC28,.2SQ,22
|
LCC28,.2SQ,22
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
1 mm
|
Supply Voltage-Max (Vsup) |
3.3 V
|
3.3 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
NICKEL GOLD
|
NICKEL GOLD
|
Terminal Form |
BUTT
|
BUTT
|
Terminal Pitch |
0.55 mm
|
0.55 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
5 mm
|
5 mm
|
Base Number Matches |
4
|
1
|
|
|
|