LP87C51BH-1 vs LP87C58-33 feature comparison

LP87C51BH-1 Intel Corporation

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LP87C58-33 Intel Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP INTEL CORP
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 40 40
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Additional Feature BOOLEAN PROCESSOR; ON-CIRCUIT EMULATION BOOLEAN PROCESSOR
Address Bus Width 16 16
Bit Size 8 8
Boundary Scan NO
Clock Frequency-Max 16 MHz 33 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code R-PDIP-T40 R-PDIP-T40
Length 52.26 mm 52.26 mm
Number of I/O Lines 32 32
Number of Terminals 40 40
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
ROM (words) 4096
ROM Programmability OTPROM OTPROM
Seated Height-Max 5.08 mm 5.08 mm
Speed 16 MHz 33 MHz
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
ECCN Code 3A991.A.2

Compare LP87C51BH-1 with alternatives

Compare LP87C58-33 with alternatives