LP87C58-33 vs P87C52IFPN feature comparison

LP87C58-33 Intel Corporation

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P87C52IFPN NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP NXP SEMICONDUCTORS
Part Package Code DIP
Package Description DIP, DIP,
Pin Count 40
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Additional Feature BOOLEAN PROCESSOR
Address Bus Width 16 16
Bit Size 8 8
Clock Frequency-Max 33 MHz 24 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code R-PDIP-T40 R-PDIP-T40
Length 52.26 mm 52 mm
Number of I/O Lines 32 32
Number of Terminals 40 40
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
ROM Programmability OTPROM OTPROM
Seated Height-Max 5.08 mm 4.7 mm
Speed 33 MHz 12 MHz
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Boundary Scan NO
Format FIXED POINT
Integrated Cache NO
Low Power Mode YES
Number of DMA Channels
Number of External Interrupts 2
Number of Serial I/Os 1
Number of Timers 3
On Chip Data RAM Width 8
On Chip Program ROM Width 8
RAM (words) 256
ROM (words) 8192
Supply Current-Max 36.22 mA

Compare LP87C58-33 with alternatives

Compare P87C52IFPN with alternatives